David W. Bondurant
4025 Becket Drive, Colorado
Springs, CO 80906
(719) 576-5543, C (719)
661-7889
http://homepage.mac.com/dbondurant
Marketing, Sales, and Management
A respected leader and manager
who offers experience distinguished by initiative and progressive growth and a
solid record of achievement in the Semiconductor or Electronic Systems
industries.
Areas of Expertise
Strategic and Tactical
Marketing
Business Development
Marketing Communications
& Public Relations
Sales and Sales Support
Applications Engineering
VLSI Design and Design
Management
CAD Software Design
Management
Computer and Digital Signal
Processor Architecture
Microprogramming and Logic Design
Professional Experience and Accomplishments
Consults with leading Wall
Street Investment firms on semiconductor and electronic systems subjects as
member of Gerson Lehrman Group Council of Technology Advisors. Performed a comprehensive study of
embedded memory technology for SoC completed for a leading SoC IP company.
Enhanced
Memory Systems, Inc. Ð Vice President of Marketing
1992 to 2002
Colorado
Springs, CO
As
a founder of Enhanced, directed a team of sales representative and distributors
that achieved 120 design wins worldwide.
Developed a marketing strategy that lead to wins at Ocean Information
Systems (Hong Kong), Digicom (Taiwan), and Texas Instruments that generated a
$100M order. In conjunction with
IBM, invented the Enhanced SDRAM product family that was approved as a JEDEC
superset standard. Worked with all
major microprocessor and computer chipset companies to enable ESDRAM support,
including design-ins at Apple, Motorola, Via Technologies, Cyrix, Analog
Devices, and V3 Semiconductors.
Developed PC133 HSDRAM memory product family that was direct marketed to
end-users and resellers via the companyÕs first e-commerce site. Signed customer-funded development
agreements with Cypress Semiconductors and Hewlett Packard that led to the
announcement of the worldÕs highest density SRAM products (Enhanced SRAM). Was principal press spokesman for
Enhanced Memory for ten years. Wrote
press releases and handled contacts with editors and market analysts. Worked with investor relations and our
PR agencies (Origin Systems and Pacifico). Developed advertising and ad copy with ad agencies (Barnhart
and Lee Reedy). Lead numerous
trade show exhibitions, presented technical papers, and participated in
industry panel discussions. Wrote collateral materials (backgrounders, product
summaries, datasheets, application notes). Managed a Marketing Communications Department.
Ramtron
International Corporation Ð Vice President of Marketing
1988 to 2002
Colorado
Springs, CO
As
one of this nonvolatile memory startup companyÕs initial leaders, developed the
first FRAM product line plan and hired the first sales manager and marketing
communications manager. Selected
sales representative and distributor network. Participated in establishing alliances with ITT
Semiconductors (Germany) and Seiko Epson Corporation (Japan). Was a press
spokesman for Ramtron for fourteen years.
Wrote press releases and handled contacts with editors and market
analysts. Worked with investor
relations and our PR agencies (Origin Systems and Pacifico). Developed advertising and ad copy with
ad agencies (Barnhart and Lee Reedy).
Lead numerous trade show exhibitions, presented technical papers, and
participated in industry panel discussions. Wrote collateral materials
(backgrounders, product summaries, datasheets, application notes). Managed a Marketing Communications
department.
Honeywell
Digital Products Ð Business Development Manager
1984 to 1988
Colorado
Springs, CO
Helped
create the Honeywell Digital Products Center (DPC), a commercial start-up
within the Honeywell Solid State Electronics Division. Served as the first design and design
automation manager and grew the group to 35 people and 3 first level
managers. Developed the DPC
business from nothing to $62M in three years. As the Commercial Business Development Manager, interacted
with sales force and representatives to support 3 major customers and smaller
design wins. Developed collateral
materials and presentations.
Promoted company at technical conferences and tradeshows.
Honeywell Solid State Electronics Ð Manager of
System Application
1980 to 1984
Plymouth, MN
¯
Chipset Architect For
VHSIC Phase 2 proposal.
¯
Marketed VHSIC
Technology to Honeywell divisions.
¯
CMOS Design Manager for
8-bit CMOS Microprocessor, Memory and I/O Macrocell Family.
¯
Principal Designer of
800 and 5,000 gate Bipolar CML Gate Array products.
¯
Principal Designer of
Bipolar CML Array Processor Chipset.
As an experienced
system architect and computer designer, joined this Honeywell division during a
period of rapid development of VHSIC technology. Positions included chip designer, VLSI design manager, and
Computer-Aided Design manager. As
the Manager of Systems Applications, marketed and sold VHSIC technology to
Honeywell divisions and helped create a commercial venture to elevate this
technology to the open market.
Held a Secret Security Clearance.
Sperry-Univac
Ð Principal Design
Engineer
1972 to 1980
Eagan,
MN
¯
Chipset Architect for
TRW/Motorola/Univac VHSIC Phase I proposal.
¯
Developed parallel DSP
System for sonar and radar, a 32-Bit Avionics Computer, a Digital
Communications Circuit Switch and Packet Switch, and a 32-bit Navigation
Computer and Ruggedized Disk Subsystem.
Initially an entry-level engineer, held increasingly responsible computer design and architecture positions, including developing computers for the Trident submarine and B1 bomber. Reported to the staff architect and developed a new Univac DSP architecture for sonar and radar applications that lead to NexRAD, the current traffic control radar system. Bid the first VHSIC program in conjunction with the TRW/Motorola team. Held a Secret Security Clearance.
Robertshaw
Controls Ð Project Engineer
1975 to 1976
Project
engineer for RobertshawÕs first microprocessor-based metro-area building
control system that connected a minicomputer-based central controller to up to
128 terminals via low speed modem connections. Worked with RobertshawÕs Lux Time division to define
microprocessor-based microwave oven controller products.
Control
Data Corporation Ð Associate Design Engineer 1971
to 1972
Evaluated
fast core memory, ECL SRAM Components.
Participated in design of CDCÕs first DRAM memory subsystem that had an
ECL logic interface. Designed and
built the production memory tester for the DRAM module using ECL logic
components.
Southwest
Bell Telephone Ð Reconstruction
Line Foreman Summer
1970
Participated
in Management Training Program during summer of my senior year of college.
Managed
two crews of reconstruction lineman cutting over customers from existing
telephone lines to new cables. Job
was challenging management assignment because work was performed in East St.
Louis, IL.
Education
In Progress - MBA In
Technical Management, University of Phoenix, Colorado Springs, CO
1971 BS EE, University of
Missouri Ð Rolla, Rolla, MO
1971 BS Physics Truman State
University Ð Kirksville, MO
á
IEEE, IEEE Computer
Society, IEEE Computer Elements Technical Committee, JEDEC DRAM Committee, Tau
Beta Pi, Phi Kappa Phi, Eta Kappa Nu, Kappa Mu Epsilon, Alpha Phi Sigma, Blue
Key
á
Former President,
Vice-President, and Secretary of Twin Cities Chapter of IEEE Computer Society
á
Registered Professional
Engineer
á
Listed in WhoÕs Who
in the West and WhoÕs Who in
Emerging Leaders
á
10 patents issued
á Over 54 Technical Publications and Conference Presentations